Unveiling the VITA 93 Quantum Microchip
VITA 93 QMC Standard: A New Solution for Rugged Embedded Computing
The VITA 93 QMC standard is set to revolutionize the world of rugged and industrial embedded computing. This new mezzanine module standard, approximately the size of an M.2 module, is optimized for high-speed, high-density I/O in harsh environments[1][5].
The standard is nearing completion and has garnered attention in the TechXchange section, highlighting its potential impact on the industry[2]. The VITA 93 QMC is designed to endure industrial and military shock and vibration conditions, making it an ideal choice for demanding applications[2].
Key features of the VITA 93 QMC include the use of Samtec's AcceleRate HD Ultra-Dense Slim Body Array connectors, which support 64-Gb/s PAM4 signaling, enabling PCI Express Gen 6 and Compute Express Link (CXL) high-speed interfaces[1][2]. Modules also feature two sets of sockets—one for power and I2C platform management, and another for I/O signals organized as multiple I/O pipes supporting single-ended or differential signals[1].
The flexibility of VITA 93 QMC modules allows for configurations of x1, x2, x3, or x4 PCIe widths, providing scalable bandwidth[2]. Larger modules can accommodate devices like GPUs or AI accelerators[2]. To further enhance modularity and functionality, carrier boards can host multiple QMC modules[3].
Elma Electronics, TEWS Technologies, and Samtec are among the companies involved in the development of VITA 93 QMC[3]. Mark Littlefield, Senior Manager of Embedded Computing at Elma Electronics, and Matthew Burns, Director of Technical Marketing at Samtec, are two of the speakers in a recent webinar discussing the features and functionality of the VITA 93 QMC standard[3]. Jan Zimmerman, General Manager at TEWS Technologies, is also a speaker in this webinar[3].
In modern embedded computing, VITA 93 QMC provides a flexible, high-speed mezzanine interconnect solution for systems where space, ruggedness, and bandwidth are critical. Spanning industrial, military, avionics, and commercial use cases, VITA 93 QMC offers a viable alternative to conventional standards like M.2, which may fall short in durability or signal speed[1][2][3].
In summary, VITA 93 QMC is actively emerging as a key standard that combines small size, rugged form factor, and ultra-high-speed serial interconnects optimized for demanding embedded applications in 2025. The upcoming webinar is an excellent opportunity to learn more about this exciting new standard.
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Data-and-cloud-computing technologies can leverage the high-speed capabilities of the VITA 93 QMC standard, as it supports PCI Express Gen 6 and Compute Express Link (CXL) high-speed interfaces. The standard's design, optimized for harsh environments, also demonstrates the power of modern technology in creating robust, industrial-grade solutions for demanding applications.
