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Expanded XENSIV Microphone Portfolio from Infineon Boasts Top-tier Audio and Power Efficiency

Expanded offerings from Infineon Technologies AG include the IM72D128V and IM69D129F, two digital PDM microphones added to their XENSIV MEMS microphone line-up.

Infineon broadens XENSIV MEMS microphone portfolio, offering top-tier audio quality and power...
Infineon broadens XENSIV MEMS microphone portfolio, offering top-tier audio quality and power efficiency

Expanded XENSIV Microphone Portfolio from Infineon Boasts Top-tier Audio and Power Efficiency

New Digital PDM Microphones Launched by Infineon Technologies AG

Infineon Technologies AG, a leading provider of semiconductor solutions, has announced the introduction of two new digital PDM microphones – the IM72D128V and the IM69D129F. These microphones are designed to deliver exceptional audio performance, energy efficiency, and robustness, making them ideal for a variety of applications.

Both the IM72D128V and IM69D129F are part of Infineon's XENSIV MEMS microphone family, renowned for its exceptional audio quality, low power consumption, and high durability. The new microphones are now available for order, and more information about them can be found at www.infineon.com/mems.

The IM72D128V stands out with a top-tier Signal-to-Noise Ratio (SNR) of 71.5 dB(A), operating at ultra-low power consumption. This makes it suitable for energy-efficient, battery-powered devices like high-end headphones. On the other hand, the IM69D129F achieves reliable audio performance with an SNR of 69 dB(A) and features low power consumption, contributing to extended battery life in portable devices.

Both microphones utilize Infineon's proprietary Sealed Dual Membrane (SDM) technology, ensuring robustness against water and dust (IP57). This feature makes them suitable for use in a wide range of environments, from industrial settings to home environments.

The IM69D129F is tailored for compact design, with a footprint of 3.5 x 2.65 x 0.98 mm3, making it ideal for space-constrained devices. The IM72D128V has a footprint of 4 x 3 x 1.2 mm3, making it suitable for most consumer devices with space constraints.

Both microphones support Voice User Interface (VUI) applications in smart speakers, automotive infotainment, IoT devices, and home and industrial automation. They can also be used in Active Noise Cancellation (ANC) headphones and earbuds, as well as high-quality audio capturing in laptops, tablets, conference systems, and cameras.

In addition, these microphones can be used in industrial or home monitoring applications that require audio pattern detection, such as industrial monitoring and home security systems. Customer samples for the IM72D128V and IM69D129F can be requested.

Infineon Technologies AG developed the IM72D128V and IM69D129F, and they are part of their XENSIV MEMS microphone family. The microphones were introduced and became available around mid-September 2025. For more information, visit www.infineon.com/mems.

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